Technology platform
TP-6: InP-based Photonic Integrated Circuits (PICs) or Chips
Application domain
Connected Mobility
Project scope
A feasibility study to evaluate the application of various state-of-the-art photonic technologies for continuous monitoring of the condition of a railway turnout, i.e. detection and/or prediction of damages such as cracks, flattening, holes or crashed heads occurring in rails and electrical machinery of the turnout.
Project leader
Stanislaw Stopinski
Project start
March 2020
Project duration
7 months